LTCC Solution for UWB/BLE Devices
In communication modules that combine UWB (Ultra‑Wideband) and BLE (Bluetooth Low Energy), LTCC (Low Temperature Co‑fired Ceramics) solutions demonstrate remarkable performance in applications requiring ultra‑high‑precision positioning as well as low power consumption and robustness.
Representative applications today include the following:
Next‑Generation Digital Keys for Automobiles (Smart Entry)
This is currently the largest and fastest‑growing market for UWB/BLE solutions using LTCC technology.
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Compliance with CCC (Car Connectivity Consortium) standards:
These solutions are used in hands-free passive entry systems, where users can unlock and start a vehicle simply by approaching it with a smartphone or smartwatch in their pocket.
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Division of roles:
BLE continuously monitors proximity between the vehicle and the smartphone at ultra-low power consumption and handles wake-up functions. Once the user approaches the vehicle, UWB is activated to measure distance precisely to the centimeter-level. This effectively prevents “relay attacks,” in which thieves relay RF signals to steal vehicles.
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Strengths of LTCC:
Because UWB operates in super high‑frequency and wide bands (3.1 GHz up to nearly 10.6 GHz), it is essential to minimize dielectric loss in the substrate and antenna. LTCC offers excellent high‑frequency characteristics along with automotive‑grade heat resistance and reliability, making it the de facto standard for in‑vehicle components.

1. Why Is LTCC Necessary for “UWB × BLE”?
Hybrid UWB and BLE systems are powerful, but they must simultaneously achieve two challenging requirements: maintaining extremely low loss across UWB’s ultra-wide high-frequency bandwidth, and providing an ultra-compact, highly robust package suitable for automotive and mobile applications.
Challenge | Solution Provided by LTCC |
|---|---|
Signal loss at high frequencies (UWB) | The inherently low dielectric loss of ceramics minimizes RF signal attenuation. |
Demand for smaller devices | Circuits and filters can be embedded three-dimensionally inside the substrate, dramatically reducing module size. |
Harsh operating environments (such as automotive) | Excellent resistance to heat and humidity, along with extremely low long-term degradation, ensures high reliability and safety. |
2. Market Trends (Evolution of UWB) and Key Applications
The UWB market is expanding rapidly due to the growing adoption of automotive digital keys and high-precision positioning systems. At the same time, the technology is evolving toward wider bandwidths, higher frequencies, and automotive-grade compatibility. In particular, the operating channels are shifting from the conventional focus on Channels 1–3 to Channels 5–12, with Channel 9 now positioned as a globally recognized mandatory channel. As a result, UWB devices are increasingly required to support wideband and multi-channel operation rather than single-channel configurations.
The market is primarily driven by CCC-compliant applications centered on automotive digital keys. UWB has been adopted as a core technology for relay attack prevention and highly accurate, centimeter-level positioning. Furthermore, the combination of UWB with BLE in the NBA configuration (IEEE 802.15.4ab, currently under standardization) configurations enables even greater positioning accuracy and lower power consumption.
These market demands require extremely high performance from RF front-end components for UWB systems. In particular, LTCC technology must simultaneously provide low dielectric loss, wideband characteristics, high-Q performance, miniaturization, and high reliability required for automotive environments. LTCC has become a critical technology platform for meeting these requirements.
3. Technical Requirements for LTCC and Filter Product Strategy (LTCC BPF)
From a product strategy perspective, BPFs supporting Channels 1–3 and compact BPFs (1608 size) for Channels 5–9 have already been commercialized. Current development efforts are focused on multi-channel support for Channels 5–12, dedicated Channel 9 filters, and integrated filters compatible with NBA configurations. This evolution aims to achieve both wider bandwidth support and higher levels of system integration.
Antenna technology is progressing in the same way, with wideband designs supporting configurations such as Channels 1–10 and Channels 5–10. These designs are compatible with global markets, automotive standards, and future channel expansion requirements.
Overall, the UWB market is evolving beyond a simple wireless communication technology into a high-precision positioning platform spanning automotive, IoT, and smart devices. LTCC-based wideband RF front-end technologies are becoming increasingly significant as a key enabler of this evolution.
4. Global Constraints on UWB Channels and Market Convergence
UWB frequency availability differs by country and region, making channel selection a critical factor for global product deployment. Among the available options, Channel 9 (approximately 7.7–8.2 GHz) has emerged as a key global channel because it can be used relatively consistently across major markets. As smartphone, automotive, wearable, and IoT manufacturers seek more common hardware platforms for worldwide deployment, the industry is gradually converging toward globally compatible channels such as Channel 9 to reduce SKU complexity, fragmented designs, and certification costs.
On the other hand, the traditionally used Channels 1–3 are becoming more difficult to use due to increasing interference from 5G, Wi-Fi, and ISM bands. This is accelerating the shift of UWB systems toward higher-frequency channels, driving the adoption of Channel 9, particularly for automotive digital keys (CCC compliant), smartphones, and global IoT devices. As a result, LTCC-based RF front-end technologies—including Channel 9-compatible BPFs, wideband filters, and globally compatible antennas—are essential players in a market moving towards greater RF integration and wider bandwidth support.
Source: TAIYO YUDEN USA
5. UWB Integration and the Evolution of RF Front Ends through LTCC
UWB is evolving from a standalone wireless component into a fully integrated part of the smartphone RF front end. As smartphone manufacturers pursue “Global SKU” designs that support worldwide frequency bands and standards with a single hardware platform, RF systems are becoming significantly more complex. In addition to ultra-wideband and multiband support, smartphones now require highly compact, high-density RF integration. The addition of UWB further complicates antenna configurations, filter architectures, coexistence design, and RF routing, particularly because UWB (6–8 GHz) must coexist closely with WiFi 6E/7 operating in the 6 GHz band.
This more crowded RF environment creates major challenges related to noise, harmonics, crosstalk, and mutual interference. As a result, high-performance RF components such as diplexers, triplexers, BPFs, LPFs, and matching circuits have become essential. LTCC technology plays a critical role in addressing these challenges through its low-loss characteristics, high-Q performance, high-frequency capability, and three-dimensional integration structure, enabling highly integrated RF filter networks within extremely compact module sizes.
Consequently, the adoption of UWB is driving a major evolution in smartphone RF front-end architecture rather than simply adding another wireless function. This trend is increasing the importance and number of LTCC-based components within devices. Ultimately, the ability to design highly integrated RF modules capable of supporting Global SKU requirements will become a key competitive advantage in the future smartphone and connected-device market.
Source: TAIYO YUDEN USA
TAIYO YUDEN Solution
TAIYO YUDEN supports next-generation RF front-end architectures requiring compact size, wideband performance, and excellent coexistence characteristics.
Our LTCC filter solutions are designed to address the increasing complexity of smartphone, automotive, wearable, and IoT RF systems, enabling stable BLE/UWB coexistence, reduced interference, and Global SKU-compatible designs for worldwide deployment.
TSB1N18D7G24LV0K2T
Low-Loss, High-Selectivity LPF for Advanced UWB RF Front Ends
TSB1N18D7G24LV0K2T is an ultra‑compact RF band‑pass filter designed for high‑frequency wireless systems operating in the 6.24–8.25 GHz range. Despite its small 1.6 mm × 0.65 mm package, it delivers low insertion loss, stable 50 Ω impedance, and excellent out‑of‑band attenuation. Its low insertion loss, strong suppression of unwanted signals, and stable performance across a wide temperature range enable highly reliable high‑frequency operation even in harsh environments.
The ultra‑miniature ceramic SMD package supports high‑density mounting, offering excellent integration even where board space is limited. With its wide operating temperature range and simple 3‑terminal configuration, it is suitable for a broad range of applications, including radar modules, communication equipment, and compact RF front‑end designs.
Product Search: TAIYO YUDEN TY-Compas
TSB1N18D7G24LV0K2T Data Sheet (Download)
TSD1N21C3G20LV0KZT
High-Isolation Diplexer Solution for BLE/UWB Coexistence
TSD1N21C3G20LV0KZT is a high efficiency, ultra compact RF diplexer designed for next generation 5G NR (5th Generation New Radio) and UWB (Ultra-Wideband) applications. It delivers a compact form factor that fits into limited board space while maintaining excellent signal quality.
It covers a low band of 1.4–5.0 GHz and a high band of 6.24–8.25 GHz, providing low insertion loss, strong out of band attenuation, and high inter band isolation. These characteristics enable clean and reliable signal transmission even in multiband environments. The device features 50 Ω impedance matched ports and comes in an ultra-small 2.0 × 1.25 mm package, making it an ideal solution for designers who require high performance RF filtering without sacrificing board space or power efficiency.
Product Search: TAIYO YUDEN TY-Compas
TSD1N21C3G20LV0KZT Data Sheet (Download)
TSA5N18D7G48LV001T
Ultra-Compact UWB Chip Antenna for High-Density Wireless Designs
TSA5N18D7G48LV001T is an ultra‑compact chip antenna optimized for UWB communication (CH5–CH10: 6.24–8.736 GHz). Despite its small size of 1.6 × 0.8 × 0.65 mm, it delivers stable wideband radiation characteristics and solid gain performance, featuring a uniform radiation pattern suitable for multidirectional communication. Its excellent VSWR characteristics ensure low reflection and stable matching, enabling highly reliable wireless performance even in space‑constrained devices such as smartphones and IoT equipment. This antenna is ideal for applications requiring both miniaturization and high performance, including UWB‑based positioning, wearables, and compact wireless modules.
TSA5N18D7G48LV001T Data Sheet (Download)
Circuit Simulation Data (Download) - UWB / BLE
Source: TAIYO YUDEN USA






