LTCC Solution for WiFi 6E/7 Market
Enabling the Next Generation of Wi-Fi with Compact RF Solutions
Wi-Fi Is Expanding. RF Design Is Becoming More Complex.
The evolution from Wi-Fi 6 to Wi-Fi 6E and Wi-Fi 7 is driving wireless connectivity toward higher speeds, lower latency, and greater capacity.
One of the most significant changes is the expansion into the 6 GHz band. In the U.S., the 6 GHz spectrum from 5.925 to 7.125 GHz provides 1,200 MHz of additional spectrum for unlicensed use, creating new opportunities for high-throughput wireless applications. Wi-Fi 7 takes advantage of this expanded spectrum with features such as 320 MHz channel bandwidth, increasing the demands placed on the RF front end.
Furthermore, standardization of the next-generation Wi-Fi 8 specification (IEEE 802.11bn) is progressing, with key specifications related to hardware implementation beginning to take shape. As early as the beginning of 2027, products based on draft specifications are expected to enter the market. As Wi-Fi continues to evolve, the requirements placed on devices are also continuing to change. Moving forward, a key design challenge will be how to efficiently integrate RF functionality into constrained form factors while supporting a growing number of frequency bands and increasingly complex RF requirements.
As wireless devices evolve, RF designers face a new challenge:
How can multiple RF bands be efficiently handled within increasingly compact devices?
The RF Challenge: More Bands, Less Space
As Wi-Fi evolves, modern wireless devices need to support multiple frequency bands, including 2.4 GHz, 5 GHz, and 6 GHz, increasing the complexity of RF front-end design. Designers must achieve effective band separation while maintaining low insertion loss, high attenuation, wide frequency coverage, and reliable RF performance. At the same time, the continued trend toward smaller, thinner, and more highly integrated devices leaves increasingly limited PCB space for RF components.
The challenge is not simply supporting more frequencies. It is supporting more frequencies without increasing RF complexity or board space.
TAIYO YUDEN Solutions
A Compact Solution for Multi-Band RF Designs
TAIYO YUDEN's Ceramic RF Devices provide a compact solution for managing multiple RF bands while helping simplify RF front-end design and conserve valuable PCB space. The lineup offers four diplexers for separating the 2.4-2.5 GHz and 5.15-7.125 GHz bands, providing wide high-band coverage for Wi-Fi 6E and Wi-Fi 7 applications.
For applications requiring additional wireless connectivity, the TST1M18D1G57LM0CYT triplexer further supports 617-1,606 MHz, together with the 2.4 GHz and 5.15-7.125 GHz bands. With these two configurations, TAIYO YUDEN offers five compact RF solutions to address different multi-band wireless architectures and design requirements.
Product Features & Advantages
TAIYO YUDEN's Ceramic Filter products for the Wi-Fi 6E/7 market offer the following key features:
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Wideband RF Coverage
Support for the 2.4 GHz band and the extended 5/6 GHz range up to 7.125 GHz helps simplify RF front-end design for next-generation Wi-Fi devices.
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Low Loss
Low insertion loss helps minimize RF signal loss and supports efficient signal transmission.
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High Attenuation
High attenuation outside the passbands helps improve band separation and reduce unwanted interference between RF paths.
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Compact, Low-Profile Design
With a footprint of only 1.6 × 0.8 mm and a maximum height of 0.65 mm, these Ceramic RF Devices help reduce PCB area in compact wireless products.
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Stable Temperature Characteristics
Specified for operation from −40°C to +85°C, supporting a wide range of consumer and industrial wireless applications.
Supporting Wi-Fi 6E and Wi-Fi 7 RF Designs
Wi-Fi 6E introduced the 6 GHz band to Wi-Fi, while Wi-Fi 7 further expands the demand for high-performance multi-band RF architectures. TAIYO YUDEN's Ceramic RF Devices help designers manage multiple RF paths in a compact component, combining:
Wide frequency coverage + Low loss + High attenuation + Compact size
for space-constrained next-generation wireless devices.
Discover the specifications, characteristic data, and other details for each product and find the right RF device for your application.
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Source: TAIYO YUDEN USA
